首页> 外文会议>2012 International Conference on Communications, Devices and Intelligent Systems. >A 2D analytical modeling approach for nanoscale strained-Si (s-Si) on silicon-germanium-on-insulator (SGOI) MOSFETs by evanescent mode analysis
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A 2D analytical modeling approach for nanoscale strained-Si (s-Si) on silicon-germanium-on-insulator (SGOI) MOSFETs by evanescent mode analysis

机译:通过渐逝模式分析对绝缘体上锗硅(SGOI)MOSFET上的纳米级应变硅(s-Si)进行二维分析建模的方法

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This paper presents a compact two-dimensional (2D) analytical model of short-channel strained-Si on SGOI MOSFETs. The channel potential is obtained by solving 2D Poisson's equation using evanescent mode analysis. The analytical model takes into account the effects of all the device parameters along with Ge mole fraction in the relaxed SiGe layer on the subthreshold device characteristics. In addition, the threshold voltage and subthreshold slope, the key subthreshold physical parameters, are formulated by employing surface potential. For the validation of model, the model results have been compared with numerical simulation results from ATLAS™ by Silvaco.
机译:本文提出了一种在SGOI MOSFET上的短沟道应变硅的紧凑二维(2D)分析模型。通过使用渐逝模式分析求解2维泊松方程来获得通道电势。该分析模型考虑了所有器件参数以及松弛SiGe层中的Ge摩尔分数对亚阈值器件特性的影响。此外,阈值电压和亚阈值斜率是关键的亚阈值物理参数,是通过利用表面电势制定的。为了验证模型,已将模型结果与Silvaco的ATLAS™数值模拟结果进行了比较。

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