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High power, high efficiency stacked mmWave Class-E-like power amplifiers in 45nm SOI CMOS

机译:采用45nm SOI CMOS的高功率,高效率堆叠式毫米波类E功率放大器

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Stacking devices in CMOS power amplifiers (PAs) increases the achievable output voltage swing, thereby increasing the output power and efficiency, particularly at millimeter-wave frequencies. This work presents stacked CMOS PAs based on an improved Class-E design methodology, where device loss is explicitly accounted for in the analysis and design procedure. Design guidelines and fundamental limits on achievable performance are presented. Two fully-integrated 45GHz prototypes with 2 and 4 stacked devices have been fabricated in IBM's 45nm SOI CMOS technology. Measurement results yield a peak PAE of 34.6% for the 2-stacked PA with a saturated output power of 17.6 dBm, and a peak PAE of 19.4% for the 4-stacked PA with a saturated output power of 20.3 dBm. The former represents the highest PAE reported for CMOS mmWave PAs, and the latter represents the highest output power achieved from a CMOS mmWave PA. The paper also describes the modeling of active and passive devices for mmWave CMOS PAs for good model-hardware correlation.
机译:CMOS功率放大器(PA)中的堆叠设备会增加可实现的输出电压摆幅,从而提高输出功率和效率,尤其是在毫米波频率下。这项工作提出了一种基于改进的E类设计方法的堆叠式CMOS PA,其中在分析和设计过程中明确考虑了器件损耗。介绍了设计指南和可达到的性能的基本限制。利用IBM的45nm SOI CMOS技术制造了两个具有2个和4个堆叠设备的完全集成的45GHz原型。测量结果得出,饱和输出功率为17.6 dBm的2堆叠PA的峰值PAE为34.6%,饱和输出功率为20.3 dBm的4堆叠PA的峰值PAE为19.4%。前者代表了CMOS mmWave PA的最高PAE,后者代表了CMOS mmWave PA所实现的最高输出功率。本文还描述了毫米波CMOS PA的有源和无源器件的建模,以实现良好的模型-硬件​​关联。

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