首页> 外文会议>2012 IEEE Compound Semiconductor Integrated Circuit Symposium. >A Compact Fully Integrated High-Efficiency 5GHz Stacked Class-E PA in 65nm CMOS Based on Transformer-Based Charging Acceleration
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A Compact Fully Integrated High-Efficiency 5GHz Stacked Class-E PA in 65nm CMOS Based on Transformer-Based Charging Acceleration

机译:基于变压器的充电加速,65nm CMOS的紧凑型全集成高效5GHz堆叠式E类功率放大器

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Device stacking enables CMOS power amplifiers (PAs) to increase the maximum achievable output voltage swing by sharing the voltage stress across multiple stacked devices, leading to higher output power and efficiency. A key requirement in stacked class-E power amplifiers is the creation of class-Elike voltage swings at the intermediary nodes. In this paper, we propose a transformer-based charging acceleration technique for stacked class-E PAs. Specifically, in a 2- stacked class-E PA, a shunt inductor is connected at the intermediary node and is magnetically coupled to the choke inductor. When compared with the conventional approach of using an uncoupled shunt inductor, the transformer-based charging acceleration approach significantly reduces the sizes of both inductors and also eliminates the extra area of the shunt inductor through vertical stacking of the windings. Because of the reduced inductor sizes, the associated loss is also reduced leading to an improvement in efficiency of approximately 7% for the 5GHz prototype described here. The differential 5GHz class-E prototype is fabricated in a standard 65nm low-power (LP) CMOS process (IBM 10LPe), and achieves a drain efficiency of 42% and an output power of 19.7dBm while consuming only 0.31mm^2 of chip area.
机译:器件堆叠使CMOS功率放大器(PA)通过在多个堆叠器件之间共享电压应力来增加最大可实现的输出电压摆幅,从而带来更高的输出功率和效率。堆叠式E类功率放大器的关键要求是在中间节点处创建类E电压摆幅。在本文中,我们为堆叠的E类功率放大器提出了一种基于变压器的充电加速技术。具体地,在2堆叠的E类PA中,并联电感器在中间节点处连接并且磁耦合至扼流电感器。与使用非耦合并联电感器的传统方法相比,基于变压器的充电加速方法显着减小了两个电感器的尺寸,并且通过绕组的垂直堆叠消除了并联电感器的额外面积。由于电感器尺寸减小,因此相关的损耗也减小了,从而导致此处所述5GHz原型的效率提高了约7%。差分5GHz E类原型采用标准的65nm低功耗(LP)CMOS工艺(IBM 10LPe)制造,其漏极效率为42%,输出功率为19.7dBm,而仅消耗0.31mm ^ 2的芯片区域。

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