首页> 外文会议>2012 IEEE Compound Semiconductor Integrated Circuit Symposium. >Towards the Monolithic Integration of III-V Compound Semiconductors on Si: Selective Area Growth in High Aspect Ratio Structures vs. Strain Relaxed Buffer-Mediated Epitaxy
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Towards the Monolithic Integration of III-V Compound Semiconductors on Si: Selective Area Growth in High Aspect Ratio Structures vs. Strain Relaxed Buffer-Mediated Epitaxy

机译:走向III-V化合物半导体在Si上的单片集成:高纵横比结构中的选择性区域生长与应变松弛的缓冲介导外延

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We report two approaches to integrate high quality III-V templates by epitaxial growth with low defectivity on Si wafers. The first approach is based on blanket, InGaAs-based Strain Relaxed Buffers grown by MOVPE on 200mm Si, and the second on the selective area MOVPE of InP in Shallow Trench Isolation structures patterned on 300mm Si. Both structures are characterized structurally and show the efficient trapping and annihilation of defects propagation from the Si/III-V interface. We believe these two approaches represent viable alternatives towards the realization of CMOS-compatible III-V templates and stacks for high-performance devices monolithically integrated on Si.
机译:我们报告了两种方法,可通过外延生长在Si晶片上以低缺陷率集成高质量的III-V模板。第一种方法基于MOVPE在200mm Si上生长的毯式,基于InGaAs的应变松弛缓冲液,第二种方法基于在300mm Si上构图的浅沟槽隔离结构中InP的选择性区域MOVPE。两种结构都具有结构特征,并显示出有效的俘获和消除了从Si / III-V界面传播的缺陷。我们相信,这两种方法是实现与CMOS兼容的III-V模板和堆栈的可行选择,这些模板和堆栈用于单片集成在Si上的高性能器件。

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