Advanced non-destructive fault isolation using computed tomography in flip-chip devices

摘要

As package integration has reached a saturation point in device miniaturization, fault isolation of flip-chip packaging defects using real-time X-ray, even when using high-magnification viewing, is facing more challenges due to the increase in package complexity and shrinking package dimensions. Computed tomography (CT) X-ray is a solution to overcome this problem. This paper compares defect detection between 2D and 3D X-ray images using the CT X-ray platform. We present specific case study discussions of various defects that were challenging for 2D X-ray but effectively isolated by 3D X-ray.