首页> 外文会议>2012 4th International Conference on Intelligent and Advanced Systems >Analysis of transcutaneous inductive powering links
【24h】

Analysis of transcutaneous inductive powering links

机译:经皮感应供电环节分析

获取原文
获取原文并翻译 | 示例

摘要

Inductive coupling link is widely used in transcutaneous power transmission to transfer data and power to the implanted biomedical devices such as implanted micro-sensor system. The inductive coupling variables play a strong rule in coupling efficiency. In this paper the coupling link variables is investigated and analyzed. The resonant frequency 13.56 MHz was used according to industrial, scientific and medical (ISM) band. Results show that the voltage gain Vgain of the inductive links is depended of coupling factor K and resistive load Rload (implanted device). The voltage gain increase with increasing the implanted resistance with constant K. Simulation show that when Rload=400Ω, the Vgain will be in maximum value, and when Rload=200Ω, the Vgain will be in minimum value and approximately 4v. With these results, the system operation is satisfied the requirement of the implanted devices power. Theoretical and simulation is done using software OrCAD-P spice 16.2.
机译:感应耦合链路广泛用于经皮功率传输中,以将数据和功率传输到植入的生物医学设备,例如植入的微传感器系统。电感耦合变量在耦合效率中起着很重要的作用。在本文中,对耦合连杆变量进行了研究和分析。根据工业,科学和医学(ISM)频段使用了13.56 MHz的谐振频率。结果表明,电感环节的电压增益Vgain取决于耦合系数K和电阻负载Rload(植入的设备)。随着常数K的增加,电压增益随注入电阻的增加而增加。仿真表明,当Rload =400Ω时,Vgain处于最大值,而当Rload =200Ω时,Vgain将处于最小值且约为4v。有了这些结果,系统操作就满足了植入设备电源的要求。使用软件OrCAD-P spice 16.2完成理论和仿真。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号