首页> 外文会议>2012 10th IEEE International Conference on Semiconductor Electronics. >Effect of annealing duration on the memristive behavior of Pt/TiO2/ITO memristive device
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Effect of annealing duration on the memristive behavior of Pt/TiO2/ITO memristive device

机译:退火时间对Pt / TiO2 / ITO忆阻器件忆阻行为的影响

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A titanium dioxide (TiO2) based memristive device was fabricated and investigated for its memristive behavior. In this paper, the effect of annealing duration on the memristive behavior of device was studied. TiO2 thin films were deposited on ITO substrate using RF magnetron sputtering method and then annealed in nitrogen at 450°C for 10, 30 and 60min. Characterization of current-voltage (I-V) measurement and surface morphology using scanning electron microscopy (FESEM) between annealed and nonannealed samples were investigated. From the result, it shows that sample annealed at 450°C for 60min resulted in switching loop with high conductivity when negative bias is applied probably due to the presence of high oxygen vacancies.
机译:制备了基于二氧化钛(TiO 2 )的忆阻器件,并研究了其忆阻性能。本文研究了退火时间对器件忆阻性能的影响。使用RF磁控溅射法将TiO 2 薄膜沉积在ITO基板上,然后在氮气中于450°C退火10、30和60分钟。使用扫描电子显微镜(FESEM)对退火和未退火样品之间的电流-电压(I-V)测量和表面形态进行了表征。从结果可以看出,在450℃下退火60分钟的样品在施加负偏压时可能具有高电导率的开关回路,这可能是由于存在高的氧空位引起的。

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