Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No. 110 Dongguanzhuang Rd., Tianhe District, 510610, Guangzhou, china;
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute No. 110 Dongguanzhuang Rd., Tianhe District, 510610, Guangzhou, china;
机译:理论预测的高导热立方Si 3 N 4和Ge 3 N 4:大功率电子器件的有前途的衬底材料
机译:WHTOL和热冲击测试下大功率LED封装的热阻和可靠性
机译:垂直排列的碳纳米管和金刚石膜在铜基板上的合成,用于大功率电子设备
机译:基板材料对大功率电子封装设备热可靠性的影响
机译:电子封装基板材料的导热系数。
机译:理论预测的高导热立方晶Si3N4和Ge3N4:大功率电子设备的有前途的衬底材料
机译:大功率和高频应用的电子设备和系统的热和电热建模