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Design and simulation of enhancement-mode N-polar GaN single-channel and dual-channel MIS-HEMTs

机译:增强型N极GaN单通道和双通道MIS-HEMT的设计和仿真

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GaN HEMTs have demonstrated higher power density and efficiency over existing technologies such as silicon and gallium arsenide (GaAs) based RF and microwave transistors [1]. Until recently, improvements in the design of GaN semiconductor device had focused on Ga-polar GaN based HEMTs. Lately, N-polar GaN shows the advantage over Ga-polar device in making enhancement-mode (E-mode) device with low access resistance, and in particular, for low voltage operation. An E-mode N-polar GaN MISFET device was demonstrated to achieve a threshold voltage of 1 V and a record-high drive current 0.74 A/mm at a gate length of 0.62 μm [2]. Unfortunately, there are few analytical and simulation models developed for E-mode N-polar GaN HEMT. Moreover, the drive current under low voltage bias for N-polar GaN HEMT is smaller than the state-of-the-art Ga-polar GaN HEMT. In this work, by 2-D simulations in Synopsys TCAD [3], we, for the first time, (1) investigated N-polar E-mode single channel GaN MIS-HEMT through simulations; (2) designed an E-mode N-polar GaN dual channel MIS-HEMT and identified the mechanism of the drive current enhancement.
机译:GaN HEMT已显示出比现有技术(例如基于硅和砷化镓(GaAs)的RF和微波晶体管)更高的功率密度和效率[1]。直到最近,GaN半导体器件设计的改进一直集中在基于Ga极性GaN的HEMT上。最近,在制造具有低访问电阻的增强模式(E-mode)器件,特别是在低压操作方面,N极性GaN优于Ga-polar器件。事实证明,E型N极GaN MISFET器件在栅极长度为0.62μm时可实现1 V的阈值电压和0.74 A / mm的记录高驱动电流[2]。不幸的是,很少有针对E模式N极性GaN HEMT开发的分析和仿真模型。此外,N极性GaN HEMT在低压偏置下的驱动电流小于最新的Ga极性GaN HEMT。在这项工作中,我们通过Synopsys TCAD的二维仿真[3],首次(1)通过仿真研究了N极E型单通道GaN MIS-HEMT; (2)设计了E型N极GaN双通道MIS-HEMT,并确定了驱动电流增强的机理。

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