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Effect of structural parameters on the performance and variations of nanosizes PNIN tunneling field effect transistor

机译:结构参数对纳米PNIN隧穿场效应晶体管性能和变化的影响

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The characteristics of PNIN tunneling field effect transistor (TFET) with nanometer sizes are investigated using TCAD simulation. The results show that the performance and variations of the device strongly depends on the key parameters such as the thickness and the doping of the middle N layer. (1) An increase in the thickness of the N layer to ∼5 nm will effectively enhance the drive current, reduce the electric field normal to the Si/SiO2 interface (Ex), and reduce the variation of the threshold voltage induced by the variation in the N layer thickness. (2) A decrease in the thickness of Si film down to ∼5 nm will also reduce Ex, but with minor effect on the on current. Therefore, the overall characteristic of PNIN devices improves with reducing the Tsi. (3) A proper doping such as ∼2×1019 cm−3 in the N layer can remove the dependence and therefore the variation of the threshold voltage on the thickness of Si film.
机译:使用TCAD仿真研究了具有纳米尺寸的PNIN隧穿场效应晶体管(TFET)的特性。结果表明,器件的性能和变化很大程度上取决于关键参数,例如中间N层的厚度和掺杂。 (1)将N层的厚度增加到约5 nm将有效地增强驱动电流,减小垂直于Si / SiO 2 界面(Ex)的电场,并减小变化N层厚度变化引起的阈值电压的变化。 (2)将Si膜的厚度减小到约5 nm也会减小Ex,但对导通电流的影响很小。因此,PNIN器件的总体特性随着Tsi的降低而提高。 (3)在N层中适当掺杂例如〜2×10 19 cm -3 可以消除依赖性,从而消除阈值电压对厚度的变化。硅片。

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