MEMS packaging technologies u00026; applications

摘要

MEMS packaging has become a major manufacturing issue for commercialization. This talk will give a short summary on several MEMS packaging technologies, including an integrated LPCVD nitride bonding process; localized eutectic, fusion and solder bonding processes; RTP (rapid thermal processing) bonding processes; nano-second laser welding process; ultrasonic sealing process; and localized CVD sealing process. The key development in low-temperature solder bonding process will be the focus of the paper by using metals as the MEMS packaging materials to overcome limitations of glass frit bonding. Two bonding methods including the pre-reflow of solder the introduction of thin metal layer are presented.