首页> 外文会议>2009 International conference on semiconductor technology for ultra large scale integrated circuits and thin film transistors (ULSIC vs. TFT) >From Amorphous-Si Thin-Film-Transistors to Single Crystal-Si Transistors: Influence of Si Crystallinity on Device Properties
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From Amorphous-Si Thin-Film-Transistors to Single Crystal-Si Transistors: Influence of Si Crystallinity on Device Properties

机译:从非晶硅薄膜晶体管到单晶硅晶体管:硅结晶度对器件性能的影响

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摘要

Silicon, under its various phases from amorphous (a-Si:H) to monocrystalline, with intermediates microcrystalline (μx-Si:H) and polycrystalline, can be used to manufacture devices with very different characteristics. We have investigated some links between device characteristics and material crystallinity. Carrier mobility is strongly dependant on defects with energy levels within the semiconductor bandgap, and these defects are reduced when crystal order is increased. The reduced drain leakage current in a-Si:H in comparison with microcrystalline (μc-Si:H) Thin-Film Transistors (TFTs) is explained by differences in material properties related to crystallinity. Finally, it is shown that μc-Si:H TFTs exhibit better threshold voltage (V_(th)) stability than a-Si:H ones. Investigation of V_(th) drift mechanisms indicates that this is related to improvement of the semiconductor material quality.
机译:硅具有从非晶态(a-Si:H)到单晶的各个阶段,中间有微晶(μx-Si:H)和多晶,可用于制造特性迥然不同的器件。我们研究了器件特性与材料结晶度之间的某些联系。载流子迁移率强烈地取决于半导体带隙内具有能级的缺陷,并且当晶体序数增加时,这些缺陷会减少。与微晶(μc-Si:H)薄膜晶体管(TFT)相比,a-Si:H的漏极泄漏电流降低了,这是由与结晶度有关的材料特性差异引起的。最后,结果表明,μc-Si:H TFT的阈值电压(V_(th))稳定性优于a-Si:H TFT。对V_th漂移机制的研究表明,这与半导体材料质量的提高有关。

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