首页> 外文会议>2009 European Microelectronics and Packaging Conference (EMPC 2009) >Packaging of silicon photonic devices: grating structures for high efficiency coupling and a solution for standard integration
【24h】

Packaging of silicon photonic devices: grating structures for high efficiency coupling and a solution for standard integration

机译:硅光子器件的包装:用于高效耦合的光栅结构和标准集成解决方案

获取原文
获取原文并翻译 | 示例

摘要

Efficient packaging in silicon photonics requires a previous development of high performance fiber coupling structures. One of the most suitable fiber coupling structures in silicon is the grating coupler. Main advantages of using such a vertical coupling technique with respect to horizontal techniques are fiber alignment tolerances and wafer scale testing. We report design, fabrication and experimental measurements of conventional SOI grating couplers. Around 40% coupling efficiency is obtained when coupling a standard singlemode fiber to a singlemode SOI waveguide with 250nmx500nm section dimensions, with a fiber tilt angle of 10°. With respect to alignment tolerances, the variation effect of different fiber positions in the grating plane was evaluated as well as different tilt angles. It was obtained that coupling efficiency is almost constant for angle errors of ±2°. In addition, a tolerance of fiber position deviations of about ±2μm was reached, making possible multifiber alignments with the use of standard fiber-arrays. As the obtained vertical orientation is not always easy to adapt to standard layouts, we also introduce here a solution for allowing the use of standard DIL or butterfly packages with horizontal orientation, illustrating the design concepts and briefly describing the technologies involved.
机译:硅光子学中的有效封装需要高性能光纤耦合结构的先前开发。硅中最合适的光纤耦合结构之一是光栅耦合器。相对于水平技术,使用这种垂直耦合技术的主要优点是光纤对准公差和晶片规模测试。我们报告了传统SOI光栅耦合器的设计,制造和实验测量。当将标准单模光纤耦合到截面尺寸为250nmx500nm,光纤倾斜角为10°的单模SOI波导时,可获得约40%的耦合效率。关于对准公差,评估了光栅平面中不同光纤位置的变化效果以及不同的倾斜角度。可以得出,对于±2°的角度误差,耦合效率几乎是恒定的。此外,光纤位置偏差的公差约为±2μm,使用标准光纤阵列可以进行多光纤对准。由于获得的垂直方向并不总是很容易适应标准布局,因此我们在这里还介绍了一种允许使用水平方向的标准DIL或蝶形包装的解决方案,阐明了设计概念并简要描述了所涉及的技术。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号