Semiconductor on Diamond (SOD) for System on Chip (SoC) Architectures

摘要

In this paper, we discuss the motivation behind semiconductor on diamond (SOD) technologies for improving thermal dissipation characteristics of semiconductor substrates. SOD substrates will become an enabling technology for next-generation systems such as system on chip (SoC) architectures. In such high performance systems, a collection of devices with large power densities packed closely on a single chip will require significantly more heat dissipation capabilities.