INTEGRATED ELECTRONIC INTERCONNECTION SOLUTIONS WITH NON-WOVEN ARAMID

摘要

Every economic studies and OEM surveys show that communications and high-speed computing are the fastest growing electronics applications. The old rules for making these electronic devices are being broken such that whenever possible, space and weight are being saved, while still maintaining reliability and cost of the system. The consumer mobile phone exemplifies this technology trend. Many models are now equipped with personal organizers, multimedia, and wireless communications capabilities. To achieve these, there is much interest in homogeneous materials systems to improve mechanical and electrical performance from the semiconductor packaging to the assembled devices. System-on-chips (SOC), system-on- package (SOP), and rigid-bend-to-fit (3D) packaging are examples of the technologies being explored to get the most performance per space. Aramid substrates are used in 100% PWB and HDI microvia stack-ups in IC packaging, handheld devices, high-end computing, backplanes, and military/ avionics, while providing reliability and reduced overall costs. The talk will focus on why non-woven aramid substrates as homogeneous materials systems improve mechanical and electrical performance from the semiconductor packaging to the assembled devices. We will share data showing the versatility and applicability of aramid non-woven reinforced substrates impregnated with various resins, including why and how non-woven aramid substrates are laser ablateable; are able to be made thin and handleable, lightweight and bendable, thermally and dimensionally stable; and has low CTE able to be used in 100% PWB and HDI microvia stack-ups in IC packaging, handheld devices, high-end computing, backplanes, and military/ avionics, while providing reliability and reduced overall costs.