首页> 外文会议>2003 Annual Power Electronics Seminar at Virginia Tech Apr 27-29, 2003 Blacksburg, VA >Design and Fabrication of the Integrated DMOS-IGBT/MPS-Rectifier Power Device
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Design and Fabrication of the Integrated DMOS-IGBT/MPS-Rectifier Power Device

机译:集成DMOS-IGBT / MPS-整流器功率器件的设计与制造

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摘要

A novel smart power device that integrates a DMOS-IGBT with an anti-parallel MPS-rectifier is proposed. High-voltage IGBTs used in power circuits require discrete power rectifiers in anti-parallel configuration for current conduction during transients. Integrating the rectifier and the IGBT in the same silicon chip can reduce part-count and cost of power module. The MPS rectifier is monolithically integrated into a scaled-up IGBT die by the allocation of a portion of the total silicon area for the rectifier, with both devices sharing common terminals. This paper discusses the design and fabrication aspects of a 1.2kV DMOS IGBT/MPS rectifier. Details of device design for the stripe and atomic lattice layout (ALL) cell geometries, termination design, mask layout and device fabrication will be discussed and supported with numerical simulations.
机译:提出了一种新型智能功率器件,该器件将DMOS-IGBT与反并联MPS整流器集成在一起。电源电路中使用的高压IGBT需要反并联配置的分立功率整流器,以便在瞬态期间进行电流传导。将整流器和IGBT集成在同一个硅芯片中,可以减少部件数和功率模块的成本。通过为整流器分配总硅面积的一部分,MPS整流器被单片集成到按比例放大的IGBT裸片中,两个器件共享公共端子。本文讨论了1.2kV DMOS IGBT / MPS整流器的设计和制造方面。条纹和原子晶格布局(ALL)单元几何结构的器件设计,端接设计,掩膜版图和器件制造的详细信息将在数值模拟中进行讨论和支持。

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