首页> 外文会议>2001 International Conference on Modeling and Simulation of Microsystems, 2001, Mar 19-21, 2001, Hilton Head Island, SC, USA >Mechanical Property Measurement of Thin-Film Gold using Thermally Actuated Bimetallic Cantilever Beams
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Mechanical Property Measurement of Thin-Film Gold using Thermally Actuated Bimetallic Cantilever Beams

机译:用热致动双金属悬臂梁测量薄膜金的力学性能

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摘要

We describe a method for estimating the Young's modulus of thin-film gold deposited on the poly2 layer in the MUMPs process is described. An optical detection system employing position sensitive detectors (PSD) is built to measure the bimetallic (gold/poly2) cantilever deflection with increasing temperature. Measured cantilever deflections are compared to finite element simulations performed with MEMCAD~(TM) which show an excellent match for a Young's modulus of 78GPa and a Poisson's ratio of 0.35.
机译:我们描述了一种估算MUMPs工艺中沉积在poly2层上的薄膜金的杨氏模量的方法。建立了使用位置敏感检测器(PSD)的光学检测系统,以测量随温度升高的双金属(金/ poly2)悬臂挠度。将测得的悬臂挠度与用MEMCAD〜(TM)进行的有限元模拟进行了比较,这些模拟显示出与78GPa的杨氏模量和0.35的泊松比非常匹配。

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