NONINVASIVE MEASUREMENTS AND COMPUTATIONAL MODELING OF SMT ASSEMBLIES

摘要

Differential thermal expansions cause strains in the interconnection structures, during functional operation of active devices. To evaluate these strains, temperature profiles of the interconnected components must be known. In this paper, a methodology for developing thermal models of surface mount technology (SMT) assemblies is presented using thermal analysis system (TAS) and its application is demonstrated by simulating thermal fields of a representative package. Thermomechanical deformations of the package are measured quantitatively using state-of-the-art laser-based optoelectronic holography (OEH) methodology. Results of TAS simulation show good correlation with noninvasive full-field-of-view OEH measurements of thermomechanical field effects of the SMT assembly under actual operating conditions.