Reliability Analysis On the Chaos induced by the Effect of the Transient Temperature Variation of a Printed Wiring Board

摘要

The transient response of a printed wiring board (PWB) under mechanical and thermal loading is analyzed. The thermal load is caused by the time-dependent temperature variation of the PWB. Analytical solution is obtained for the equation of motion in nonlinear dynamics analysis. Numerical results showed that the response is in chaotic behavior under harmonic excitation due to the transient thermal effect. PWB response is characterized with respect to the thermal and mechanical load effect in both phase diagram and temporal oscillation.