A NEW MANUFACTURING PROCESS FOR HIGH VOLUME PRODUCTION OF CERAMIC COLUMN GRID ARRAY MODULES

摘要

Ceramic column grid array modules have been gaining popularity for electronic packaging of high performance asics with over 625 I/Os. To support this growing demand, a new assembly line had to be developed, providing not only high capacity, but also competitive costs and a level of quality suitable for high end applications. This paper describes how the various aspects of the new assembly line, based on a new column attach process (CLASP), were developed and optimized. More specifically, it will describe the use of multi-up processing, a combination of customized tools and standard surface mount equipment, the integration of a semi-aqueous flux cleaning process, automated column planarization and finally the development of automated column inspection technology. The concepts and processes were developed for both 1.27mm and 1.00mm pitch products on ceramic carriers up to 1600 I/Os.