Novel, Practical Materials for Embedded Capacitors and Resistors ― an Update

摘要

Most technology roadmaps today envision embedded resistors and capacitors as a companion enabling technology to microvias in a printed wiring board or chip carrier. Continually increasing OEM demand for performance, reliability and small form factor dictates that embedded resistors and capacitors be fabricated from more advanced materials than those available today. This technology gap has been explicitly identified by The National Electronics Manufacturing Initiative (NEMI) in its 1998 "Passive Component Technology Roadmap". Recent developments in thin film deposition methods now present the opportunity to produce unique composite materials for resistors and ultra thin, non-porous dielectrics for capacitors. Thin film materials will be described that are in the resistivity range of 25 to 1,000,000 ohms/square or with capacivity as high as 750 nF/cm~2; are provided in full size format; are fabricated with normal P WE processes; and provide passive devices with excellent finished value tolerance. These materials were previously either unavailable or too expensive to compete with discrete or integrated passive devices, but now will present the packaging community with the opportunity to meet or exceed the requirements defined in the NEMI Roadmap. The initial public announcement of these materials occurred at IPC EXPO 99. This paper is the progress report on the subsequent development, including reliability data on resistor test vehicles. Status of capacitor materials will also be discussed.