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The Drive Circuit Design for Paralleling Operation of Enhancement GaN HEMT in an Isolated DC-DC converter

机译:隔离式DC-DC转换器中并联GaN HEMT并联操作的驱动电路设计

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For current limitation of a single low voltage enhancement mode GaN HEMT, paralleling of GaN HEMT are essential in high current and low voltage applications. Through parallel GaN HEMT, the converter will increase the power handling capability and realize high efficiency. Driving paralleled operation GaN HEMT needs special care on parameters design of both driving circuit and power device layout, because the low gate-to-source maximum voltage (Vgs) rating and low gate threshold voltage (Vth) raise some strict constrains and challenges. This paper presents the driving challenges in paralleling of GaN devices in an isolated dc-dc converter. The design rules for gate driver and PCB layout are concluded based on the analysis of parasitic. The hardware prototype of a 300W flyback forward isolated converter with paralleling of GaN devices is implemented and presented in this paper.
机译:对于单个低压增强模式GaN HEMT的电流限制,GaN HEMT的并联在大电流和低压应用中至关重要。通过并联的GaN HEMT,该转换器将提高功率处理能力并实现高效率。驱动并行操作GaN HEMT需要特别注意驱动电路和功率器件布局的参数设计,因为栅极到源极的最大电压低(V \ n gs \ n)额定值和低栅极阈值电压(V \ n <子xmlns:mml = \“ http://www.w3.org/1998/Math/MathML \” xmlns:xlink = \“ http://www.w3.org/1999/xlink \”>第 \ n)提出一些严格的约束和挑战。本文提出了隔离式DC-DC转换器中GaN器件并联的驱动挑战。基于寄生分析,得出了栅极驱动器和PCB布局的设计规则。本文实现并介绍了具有GaN器件并联功能的300W反激式前向隔离转换器的硬件原型。

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