State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China;
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China;
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China;
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China;
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China;
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an, China;
driver circuits; elemental semiconductors; field effect transistor switches; gallium compounds; III-V semiconductors; power HEMT; power MOSFET; power semiconductor switches; silicon; wide band gap semiconductors;
机译:用于大功率开关应用的级联Paralleled-GaN-HEMT封装的热性能评估
机译:使用HiSIM-GaN紧凑模型分析大功率应用中GaN高电子迁移率晶体管的开关特性
机译:适用于电源开关应用的624 V 5 A全GaN集成共源共栅
机译:用于高功率应用的新型Cascode GaN交换机集成并联GaN DHEMTS
机译:高功率和高频应用垂直GaN晶体管的设计与制造
机译:Si上In0.18Al0.82N / AlN / GaN MIS-HEMT(金属绝缘体半导体高电子迁移率晶体管)的陡峭开关
机译:一个624 V 5 ALL-GAN集成CASCODE用于电源切换应用
机译:用于大功率开关应用的siC双极晶体管和GaN异质结双极晶体管的探索性开发。