LTCC-M Technology for PDP Back Panel

摘要

LTCC-M (Low Temperature Co-fired Ceramic on Metal) technology is described in terms of structural characteristics, materials and processes. Much works on material systems to minimize thermal mismatches and barrier formation processes to have uniform height and shape are introduced and some results from the fabrication of back panels having barrier ribs in 165 μm pitch are shown. Finally, further challenges for back panels of HD resolution are discussed.