LOCALIZED ELECTROCHEMICAL DEPOSITION OF COPPER MICROSTRUCTURES (II): ARTIFACTS OF ELECTRODE-TIP GEOMETRY

摘要

This paper presents an experimental demonstration and numerical investigation of the artifacts of the electrode-tip geometry on the shape and confinement of microstructures fabricated by localized electrochemical deposition. Factors such as symmetry of electrode-tip geometry, boundary of electrode insulation, and thickness of the electrode insulating material are investigated to determine their influence on the formation of deposited structures. The presented experimental work and numerical simulation suggest that all these factors highly influence the formation of deposited structures, especially when deposition is produced near the substrate surface. Moreover, it is concluded that the electrode insulating material and geometry greatly affect the deposition shape and that the reduction of the extent of insulating material around the electrode provides favorable results and a more controlled and confined deposition.