Direct immersion Liquid Cooling of a 3D MCM

摘要

A direct immersion, single phase, forced convection, liquid cooling technique has been developed to cool high performance three-dimensional Multichip Modules, 3D MCMs. Extensive numerical analysis using commercial Computational Fluid Dynamics code has been carried out for concept development, optimization of the design, and to study the limits of this cooling technology. Experimental measurements have been carried out in a specially designed test apparatus to verify the numerical results and to demonstrate concept feasibility. It has been shown that chips up to 120 Watts, with chip level heat flux of more than 200 Watts/cm~2, substrate level heat flux of 90 W/cm~2 and volumetric power density of over 260 W/cm~3 can be cooled by the proposed technology.