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Electro-thermal characterization of a differential temperature sensor and the thermal coupling in a 65nm CMOS IC

机译:差分温度传感器的电热特性和65nm CMOS IC中的热耦合

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This paper explains the design decisions and the different measurements we have done in order to characterize the thermal coupling and the characteristics of temperature sensors embedded in a integrated circuit implemented in a CMOS 65nm technology. The circuit contains a 2GHz linear power amplifier, MOS transistors behaving as heat sources and two differential temperature sensors. Temperature measurements performed with the embedded sensor are corroborated with an Infra-Red camera and a laser interferometer used as thermometer.
机译:本文介绍了设计决策和我们所做的不同测量,以表征热耦合和温度传感器的特性,温度传感器嵌入在以CMOS 65nm技术实现的集成电路中。该电路包含一个2GHz线性功率放大器,表现为热源的MOS晶体管和两个差分温度传感器。用红外摄像头和用作温度计的激光干涉仪证实了使用嵌入式传感器执行的温度测量。

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