DOE FOR PROCESS VALIDATION INVOLVING NUMEROUS ASSEMBLY MATERIALS AND TEST METHODS

摘要

Selecting products that have been qualified by industryrnstandards for use in printed circuit board assembly processesrnis an accepted best practice. That products which have beenrnqualified, when used in combinations not specificallyrnqualified, may have resultant properties detrimental tornassembly function though, is often not adequatelyrnunderstood. Printed circuit boards, solder masks, solderingrnmaterials (flux, paste, cored wire, rework flux, paste flux,rnetc.), adhesives, and inks, when qualified per industryrnstandards, are qualified using very specific test methodsrnwhich may not adequately mimic the assembly processrnultimately used. It is recommended that products used inrncombination on a printed circuit assembly be qualified inrncombination to the extent necessary to provide a fullrnunderstanding of interactions that may occur in the product.rnIPC J-STD-001 provides good guidance with regards tornprocess validation testing although said testing is limited tornthe Appendix of the document.