Investigation on structure and properties of copper chloride-doped polyurethane films II. Some thermal and mechanical properties

摘要

The article presents the effect of variation in the concentration of copper chloride on some thermal and mechanical properties of polyurethane films. The storage modulus and the glass transition temperature were determined using dynamic mechanical analysis. It was observed that the glass transition temperatures of the doped films are higher than that for the polyurethane film, increasing with increase in the dopant concentration. The storage modulus of the polyurethane is enhanced in the presence of copper chloride, hut is higher for the low copper concentration than for the high one. The tensile strength is better for the doped films than for the polyurethane film, decreasing as the copper chloride content increases. As compared to the thermal behavior of the polyurethane, the initial thermal stability of the doped polyurethane is lower and the final decomposition stage is catalyzed, but the intermediate decomposition products are more thermally stable.