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Structure-property correlation for thin films of semi-interpenetrating polyimide networks. II. Anisotropy in optical, electrical, thermal, and mechanical properties

机译:半互穿聚酰亚胺网络薄膜的结构性质相关性。二。光学,电,热和机械性能中的各向异性

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Three different semi-IPN polyimide systems were prepared through blending in solution by using two different polyimides, such as poly (p-phenylenebiphenyl tetracarbonyimide) (BPDA-PDA) and poly (4,4'-oxydiphylene pyromellitimide) [PMDA-ODA(E)I, and two different oligomers, such as bismaleimide (MDAB) and phenylthynyl-terminated BPDA-PDA (BPDA-PDA-PEPA) oligomers. These crosslinkable oligomers are used to modify the morphology of polyimides and, therefore, change the anisotropic properties of the resulting semi-TPN polyimide systems. The results show that the crosslinkable oligomers can disrupt the in-plane molecular arrangement which gives rise to an increase in lateral CTE and vertical CTE and a decrease in birefringence and the Young's modulus. The dielectric constant and water absorption increase with increasing MDAB content but decrease with increasing PEPA content. An empirical correlation between density and volume expansion is observed, indicating a correlation between the volume expansion and free volume expansion and free volume in the semi-IPN polyimide systems. The in-plane modulus decreases but the vertical moduli increases with increasing content of crosslinkable oligomers. In addition, the vertical modulus is affected by the free volume at low stress levels and can be enhanced by crosslinks or by a crystallinelike phase at higher stress :levels. (C) 1998 John Wiley & Sons. [References: 27]
机译:通过使用两种不同的聚酰亚胺在溶液中共混,制备了三种不同的半IPN聚酰亚胺体系,例如聚(对-亚苯基联苯四碳酰亚胺)(BPDA-PDA)和聚(4,4'-氧二茂基均苯四甲酰亚胺)[PMDA-ODA(E I)和两种不同的低聚物,例如双马来酰亚胺(MDAB)和苯乙炔基封端的BPDA-PDA(BPDA-PDA-PEPA)低聚物。这些可交联的低聚物用于修饰聚酰亚胺的形态,并因此改变所得半TPN聚酰亚胺体系的各向异性。结果表明,可交联的低聚物可以破坏平面内的分子排列,从而引起横向CTE和垂直CTE的增加,以及双折射和杨氏模量的降低。介电常数和吸水率随MDAB含量的增加而增加,但随PEPA含量的增加而降低。观察到密度与体积膨胀之间的经验相关性,表明在半IPN聚酰亚胺系统中体积膨胀与自由体积膨胀与自由体积之间的相关性。平面内模量随着可交联低聚物含量的增加而降低,但垂直模量却增加。另外,垂直模量在低应力水平下受自由体积的影响,在较高应力水平下可通过交联或结晶状相来增强。 (C)1998 John Wiley&Sons。 [参考:27]

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