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Cost Trade-offs of Constrained Sintering of Low Temperature Cofired Ceramic

机译:低温共烧陶瓷约束烧结的成本权衡

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摘要

In this paper, the results of a cost model study of conventional unconstrained (UCS) sintering, pressureless constrained sintering (PLAS), and pressure assisted constrained sintering (PAS) of Low Temperature Cofired Ceramic (LTCC) for applications in automotive, wireless telecommunications and consumer applications are reviewed. Results include a discussion of key assumptions and a sensitivity analysis performed to determine how assumptions influenced cost for each process. These results identify cost drivers, and suggest opportunities for improving the cost effectiveness of each process.
机译:本文对用于汽车,无线电信和通信的低温共烧陶瓷(LTCC)的常规无约束(UCS)烧结,无压约束烧结(PLAS)和压力辅助约束烧结(PAS)进行成本模型研究。消费者应用程序进行了审查。结果包括对关键假设的讨论和敏感性分析,以确定这些假设如何影响每个过程的成本。这些结果确定了成本动因,并为改善每个流程的成本效益提供了机会。

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  • 会议地点 Harrogate(GB);Harrogate(GB)
  • 作者单位

    DuPont Microcircuit Materials, Research Triangle Park NC, 919/248-5084 fax 919/248-5715 Bad Homberg Germany;

    DuPont Microcircuit Materials, Research Triangle Park NC, 919/248-5084 fax 919/248-5715 Bad Homberg Germany;

    DuPont Microcircuit Materials, Research Triangle Park NC, 919/248-5084 fax 919/248-5715 Bad Homberg Germany;

    DuPont Microcircuit Materials, Research Triangle Park NC, 919/248-5084 fax 919/248-5715 Bad Homberg Germany;

    DuPont Microcircuit Materials, Research Triangle Park NC, 919/248-5084 fax 919/248-5715 Bad Homberg Germany;

    DuPont Microcircuit Materials, Research Triangle Park NC, 919/248-5084 fax 919/248-5715 Bristol, U.K.;

    DuPont Microcircuit Materials, Research Triangle Park NC, 919/248-5084 fax 919/248-5715 Utsunimiya, Japan;

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  • 正文语种 eng
  • 中图分类 封装及散热问题;
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