UNVEILING THE NEXT GENERATION IN SUBSTATE TECHNOLOGY

摘要

A close look at this technology reveals benefits and opportunity for significant gap closure to current needs in the chip packaging industry today. The laser structured approach offers a unique opportunity to simultaneously improve upon traditionally incremental improvements in design as well as optimize electrical performance at the same time by reducing signal paths. Ultimately, this approach addresses critical needs for the coming generations of chip packaged substrates by not only driving miniaturization in design, but also by improving the electrical performance of the package as well. This paper unveils the technology and benefits that the laser embedded approach provides.