LEAD FREE WAVE SOLDERING: PROCESS OPTIMIZATION FOR SIMPLE TO HIGHLY COMPLEX BOARDS

机译：无铅波峰焊接：简单到高度复杂板的工艺优化

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

The critical aspects of the lead free wave soldering process can be broken down into several categories which include component reliability, board reliability, flux type and specifications, alloy and alloy composition, its melting behavior, wave equipment capacity and power requirements, profile attributes and flexibility.

机译：无铅波峰焊工艺的关键方面可以分为几类，包括组件可靠性，电路板可靠性，助焊剂类型和规格，合金和合金成分，其熔化行为，波峰设备的容量和功率要求，外形属性和灵活性。。

著录项

来源
《12th Annual Pan Pacific Microelectronics Symposium amp; Tabletop Exhibition: International Technical Interchange》|2007年|P.1-11|共11页
会议地点 Maui HI(US)
作者
Denis Barbini; Paul Wang; Peter Biocca; Quyen Chu; Tim Dick; Denis Jean; Stuart Longgood; Chrys Shea; Keith Sweatman; Mike Yuen;
展开▼
作者单位

Stratham, NH, USA;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
Lead Free; Pb Free; wave soldering; process; solder; alloy; flux.;

机译：无铅;无铅;波峰焊;工艺;焊接;合金;助焊剂;

相似文献

外文文献
中文文献
专利

1. Wave solder: Process optimization forsimple to complex boards [J] . Denis Barbini, Paul Wang Global SMT & Packaging: European Edition (Surface Mount Technology) . 2007,第9期

机译：波峰焊：针对简单到复杂电路板的工艺优化
2. Printed board assemblies sag during lead-free wave soldering: But they don't have to with good design [J] . Bob Willis Global SMT & Packaging: European Edition (Surface Mount Technology) . 2005,第3期

机译：无铅波峰焊期间印刷电路板组件会下垂：但是它们不必具有良好的设计
3. Complex evaluation and development of electrolytic tin refining in acidic chloride media for processing tin-based scrap from lead-free soldering [J] . T. Kulcsar, G. B. Toth, T. Kekesi Transactions of the Institutions of Mining and Metallurgy, Section C. Mineral Processing and Extractive Metallurgy . 2016,第4期

机译：在酸性氯化物介质中电解锡精炼的综合评估和开发，以处理无铅焊接中的锡基废料
4. LEAD FREE WAVE SOLDERING: PROCESS OPTIMIZATION FOR SIMPLE TO HIGHLY COMPLEX BOARDS [C] . Denis Barbini, Paul Wang, Peter Biocca, Annual Pan Pacific Microelectronics Symposium Tabletop Exhibition . 2007

机译：无铅波焊：工艺优化，适用于高度复杂的板
5. Lead-free soldering materials, reliability and process optimization. [D] . Belbase, Hemant. 2000

机译：无铅焊接材料，可靠性和工艺优化。
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. [O] . Ariff Syakirin Ghazalli 2007

机译：无铅焊料（Sn0.7Cu）和印刷电路板在各种热处理温度下的联合焊料。
8. Prototyping lead-free solders on hand-soldered, through-hole circuit boards [R] . Vianco, P T, Mizik, P M 1993

机译：在手工焊接的通孔电路板上制作无铅焊料原型

LEAD FREE WAVE SOLDERING: PROCESS OPTIMIZATION FOR SIMPLE TO HIGHLY COMPLEX BOARDS

摘要

著录项

相似文献

相关主题

期刊订阅