EFFECTS OF PROCESS PARAMETERS ON THE MATERIAL CHARACTERISTICS OF DIE ATTACH ADHESIVES

摘要

This paper will study the material characteristics, such as applied strain levels, during processing and after cure in order to maximize the overall robustness of a package or CCA design. The test protocol is designed to evaluate various die attach adhesives and their cure schedules with process variables such as cure time, cure temperature, and cure schedule type (e.g. single step or multi-step). This data set will capture micro-strain measurements during and after cure of the adhesive as well as the shear strength of the cured die attach adhesive in order to correlate which process parameters deliver the lowest strain gage levels and highest shear values at the die level after thermal cure. The analysis of correlating shear test data versus strain gage measurements as compared to adhesive selection and cure profile will provide the process engineer the necessary data to determine the optimal material set and cure profile parameters.