The reflectivity reaches the lowest point at a right texturization time.Both large and small pyramid sizes lead to similar reflectivities.Nonuniform flow leads to nonuniform distribution of pyramid size.Wafer with SDR absorbs greater amount of additive than rough wafer.Enhancing the basicity of solution increases cleaning efficiency.The residue of additive on the textured wafer increases while applying SDR. A possible explanation could be that the wafer with arough surface reacts violently with KOH, releasing a large amount of H2, which hindering the absorption of additive to the wafer surface.
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