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MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD
MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD
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机译:结构和MULTI-DIE MULTI-DIE包曾方法
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摘要
A multi-die package structure with an embedded die embedded in a substrate, a flip chip die mounted above the substrate, and an attached die attached onto the flip chip die. The package is compact and low cost.
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