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Multi-die semiconductor package structure and method for manufacturing the same
Multi-die semiconductor package structure and method for manufacturing the same
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机译:多管芯半导体封装结构及其制造方法
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摘要
The present invention provides a multi-die semiconductor package structure and a manufacturing method thereof, which includes providing at least two dies and a lead frame including a die pad and a lead wire located at the periphery of the die pad, the die pad has a via hole at the edge thereof, binding a base opposite side of a first die to the die pad; electrically connecting the first die to the lead wire through the via hole; binding a base side of a second die to the die pad, the first and second dies are disposed on the opposite sides of the die pad respectively; electrically connecting the second die to the lead wire; stacking other dies above the first or second die and electrically connecting them to the lead wire; and encapsulating said at least two dies and the lead frame to form a package.
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