Multi-station processing tools with station-varying support features for backside processing

摘要

Multi-station processing tools with station-variable support features for backside processing are provided. The support features of the first station may hold the wafer at a first set of points at these points during backside deposition, backside deposition blocking, etching, or other processing. The support features of the second station may hold the wafer at a second set of points that do not overlap the first set of points.