Low-diffusion copper/nickel alloy powder for ceramic devices, manufacturing method the same, paste including copper/nickel alloy powder, and ceramic device including copper/nickel alloy powder

摘要

The present invention relates to a low-diffusion copper/nickel alloy powder for a ceramic device, a method for manufacturing a copper/nickel alloy powder, a paste including the copper/nickel alloy powder, and a ceramic device including a copper/nickel alloy powder, a copper (Cu) powder and a powder mixing step of mixing nickel (Ni) powder; a heat treatment reduction step of heat-treating the copper powder and the nickel powder under a reducing atmosphere to form a copper/nickel alloy powder; a heat treatment oxidation step of heat-treating the copper/nickel alloy powder in an oxidizing atmosphere to form a copper oxide/nickel oxide powder; a grinding step of pulverizing the copper oxide/nickel oxide powder to reduce the diameter; and a heat treatment re-reduction step of re-reducing the copper oxide/nickel oxide powder having the reduced diameter to a copper/nickel alloy powder by heat treatment in a reducing atmosphere. As a result, it is possible to prevent the diffusion of copper constituting the internal electrode into the PZT-based ceramic, thereby stably maintaining the insulating properties of the PZT-based ceramic, as well as improving the electrical conductivity of the internal electrode.