首页> 外国专利> NICKEL-COPPER ALLOY POWDER, PROCESS FOR PRODUCING THE NICKEL-COPPER ALLOY POWDER, CONDUCTIVE PASTE, AND ELECTRONIC COMPONENT

NICKEL-COPPER ALLOY POWDER, PROCESS FOR PRODUCING THE NICKEL-COPPER ALLOY POWDER, CONDUCTIVE PASTE, AND ELECTRONIC COMPONENT

机译:镍铜合金粉,镍铜合金粉的生产工艺,导电性糊剂和电子元件

摘要

Disclosed is a nickel-copper alloy powder of ultrafine particles.  Also disclosed is a process for mass-producing the alloy powder of ultrafine particles.  Also disclosed is an electronic component that comprises a conductor film in a thin layer form formed, using a conductive paste of the nickel-copper alloy powder of ultrafine particles, on a surface of an insulator and can suppress the occurrence of delamination and the like.The alloy powder comprises nickel and copper, has an average particle diameter of 5 to 30 nm, and exhibits such an X-ray diffraction pattern that the highest diffraction intensity among the diffraction intensity of a main peak of an alloy that comprises the nickel and the copper and has a hexagonal close-packed structure (hcp), the diffraction intensity of a main peak of an oxide of the nickel, and the diffraction intensity of a main peak of an oxide of the copper is not more than 10% of the diffraction intensity of a main peak of an alloy that comprises the nickel and the copper and has a cubic close-packed structure (ccp).  A conductive paste is prepared from the alloy powder.  The conductive paste is printed on a surface of an insulator, followed by sintering to obtain a sintered compact and thus to produce an electronic component.
机译:公开了超细颗粒的镍铜合金粉末。还公开了一种用于大量生产超细颗粒的合金粉末的方法。还公开了一种电子部件,其包括在绝缘体的表面上使用超细颗粒的镍-铜合金粉末的导电浆料形成的薄层形式的导体膜,并且可以抑制分层等的发生。合金粉末包含镍和铜,平均粒径为5至30nm,并且表现出这样的X射线衍射图案:在包含镍和铜的合金的主峰的衍射强度中,衍射强度最高。铜,具有六方密堆积结构(hcp),镍的氧化物的主峰的衍射强度和铜的氧化物的主峰的衍射强度不大于衍射的10%包含镍和铜并具有立方密堆积结构(ccp)的合金主峰的强度。由合金粉末制备导电膏。将导电膏印刷在绝缘体的表面上,然后进行烧结以获得烧结体,从而生产电子部件。

著录项

  • 公开/公告号WO2010035573A1

    专利类型

  • 公开/公告日2010-04-01

    原文格式PDF

  • 申请/专利权人 KYOCERA CORPORATION;TERASHIYOSHITAKE;

    申请/专利号WO2009JP63389

  • 发明设计人 TERASHIYOSHITAKE;

    申请日2009-07-28

  • 分类号B22F1/00;B22F9/24;C22C9/06;C22C19/03;H01B1/02;H01B1/22;H01B5/00;H01B5/14;H01B13/00;H01G4/12;

  • 国家 WO

  • 入库时间 2022-08-21 18:38:59

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