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NICKEL-COPPER ALLOY POWDER, PROCESS FOR PRODUCING THE NICKEL-COPPER ALLOY POWDER, CONDUCTIVE PASTE, AND ELECTRONIC COMPONENT
NICKEL-COPPER ALLOY POWDER, PROCESS FOR PRODUCING THE NICKEL-COPPER ALLOY POWDER, CONDUCTIVE PASTE, AND ELECTRONIC COMPONENT
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机译:镍铜合金粉,镍铜合金粉的生产工艺,导电性糊剂和电子元件
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摘要
Disclosed is a nickel-copper alloy powder of ultrafine particles. Also disclosed is a process for mass-producing the alloy powder of ultrafine particles. Also disclosed is an electronic component that comprises a conductor film in a thin layer form formed, using a conductive paste of the nickel-copper alloy powder of ultrafine particles, on a surface of an insulator and can suppress the occurrence of delamination and the like.The alloy powder comprises nickel and copper, has an average particle diameter of 5 to 30 nm, and exhibits such an X-ray diffraction pattern that the highest diffraction intensity among the diffraction intensity of a main peak of an alloy that comprises the nickel and the copper and has a hexagonal close-packed structure (hcp), the diffraction intensity of a main peak of an oxide of the nickel, and the diffraction intensity of a main peak of an oxide of the copper is not more than 10% of the diffraction intensity of a main peak of an alloy that comprises the nickel and the copper and has a cubic close-packed structure (ccp). A conductive paste is prepared from the alloy powder. The conductive paste is printed on a surface of an insulator, followed by sintering to obtain a sintered compact and thus to produce an electronic component.
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