LAYERED TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE RESONATOR AND PACKAGING METHOD

摘要

A layered temperature-compensated surface acoustic wave resonator and a packaging method therefor. The layered temperature-compensated surface acoustic wave resonator comprises a substrate layer (101), a temperature compensation layer (102), a piezoelectric film layer (103) and an electrode layer (104), wherein the temperature compensation layer (102) is located between the substrate layer (101) and the piezoelectric film layer (103), and the substrate layer (101) and the temperature compensation layer (102), and the temperature compensation layer (102) and the piezoelectric film layer (103) are integrally combined in a wafer bonding manner, and the electrode layer (104) is arranged on the surface of the piezoelectric film layer (103). The temperature compensation layer (102) is made of a material having a positive temperature coefficient, and thus the temperature stability of the surface acoustic wave resonator can be effectively enhanced. In addition, optimizing the parameters of various layers of materials in the surface acoustic wave resonator can also ensure that the surface acoustic wave resonator has a higher electromechanical coupling coefficient, thereby facilitating the implementation of a low-temperature drift, high-frequency and large-bandwidth filter.