Wafer manufacturing method, epitaxial wafer manufacturing method, wafers manufactured by this, and epitaxial wafers

摘要

PROBLEM TO BE SOLVED: To provide a wafer having a low density of micropipe defects and minimizing the generation of particles and scratches, an epitaxial wafer having a low density of downfalls, triangles and carrot defects, and exhibiting excellent element characteristics, and a method for manufacturing the same. I will provide a. SOLUTION: The average density of particles having one surface and the other surface, the total scratch length on the one surface is equal to or less than the length of the diameter of the wafer, and the particle size is 0.3 μm or more on the one surface is 3 / cm. Provided is a wafer having an average density of 2 or less and an average density of micropipes of 3 / cm 2 or less on one surface thereof. [Selection diagram] None