Fab management with dynamic sampling planning, optimized wafer measurement path and optimized wafer transfer using quantum computing

摘要

Systems and methods are provided for optimizing wafer transfer and metrology measurements in a fab. The method includes deriving and updating a dynamic sampling plan that provides wafer-specific measurement sites and conditions; deriving an optimized wafer measurement path for metrology measurement of the wafer corresponding to the dynamic sampling plan; A Front Opening Unified Pod (FOUP) with each wafer provides dynamic sampling plans and wafer measurement paths to each measurement tool before or as it is transported to each measurement tool while transporting wafers to and from the fab through the fab. managing FOUP transfers; performing metrology and/or inspection measurements of each wafer by a respective measurement tool according to the derived wafer measurement path. Quantum computing resources can be used to solve corresponding specific optimization problems, reduce the time required, improve computed solutions, and improve fab yield and accuracy of produced wafers.