首页> 外国专利> METHOD FOR PRODUCING A TRANSISTOR CHANNEL WITH VERTICAL TAPED NANOSCHES CONNECTED BY FINANCIAL BRIDGE ZONES

METHOD FOR PRODUCING A TRANSISTOR CHANNEL WITH VERTICAL TAPED NANOSCHES CONNECTED BY FINANCIAL BRIDGE ZONES

机译:用金融桥区连接的垂直带状纳米线制作晶体管沟道的方法

摘要

Method (4000) for forming a semiconductor unit (1600), wherein the method comprises:forming (4002) a nanolayer stack over a substrate (1604), wherein the nanolayer stack has one or more first semiconductor layers (1606) and one or more first victim layers (1608);forming (4004) a trench (1706) by removing a portion of one or more first semiconductor layers and one or more first victim layers, wherein through the trench an area of a bottom victim layer of one or more first victim layers is exposed; andFilling (4006) of the trench with one or more second semiconductor layers (1802) and one or more second victim layers (1804), so that each of the one or more second semiconductor layers is in contact with a sidewall of one or more first semiconductor layers, wherein the one or more second semiconductor layers each form a vertical fin, the long sides of which are defined by sides of the trench.
机译:用于形成半导体单元(1600)的方法(4000),其中该方法包括:在衬底(1604)上形成(4002)纳米层堆栈,其中该纳米层堆栈具有一个或多个第一半导体层(1606)和一个或多个第一受害层(1608);通过移除一个或多个第一半导体层和一个或多个第一受害层的一部分来形成(4004)沟槽(1706),其中通过沟槽暴露一个或多个第一受害层的底部受害层的区域;以及用一个或多个第二半导体层(1802)和一个或多个第二受害层(1804)填充(4006)所述沟槽,使得所述一个或多个第二半导体层中的每一个与一个或多个第一半导体层的侧壁接触,其中所述一个或多个第二半导体层各自形成垂直翅片,其长边由沟槽的侧面限定。

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