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Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
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机译:带有盲孔的组件载体,盲孔填充导电介质,并满足最小厚度设计规则
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摘要
A component carrier with a stack including an electrically insulating layer structure and an electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 μm. A demarcation surface of the plating layer in the blind hole and facing away from the stack extends laterally outwardly from the bottom of the blind hole towards a lateral indentation and extends laterally inwardly from the indentation up to an outer end of the blind hole. An electrically conductive structure fills at least part of a volume between the plating layer and an exterior of the blind hole.
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