HYBRID LEADER PACKAGE AND METHOD FOR MANUFACTURING HYBRID LEADER PACKAGE

摘要

Semiconductor package (100), comprising:a substrate (102), where the substrate is a metal substrate;an RF semiconductor chip (106) attached to the substrate (102);a capacitor (Cout) attached to the substrate (102);a first package port (110) on the substrate (102);a first group of bond wires or bands (132) connecting the first package connector (110) to an output of the RF semiconductor chip (106), each of the first group of bond wires (132) having predominantly a material other than gold; andpredominantly gold bond wires or bands connecting the capacitor (Cout) to the output of the RF semiconductor chip (106), the predominantly gold bond wires or bands being designed for this purpose; absorb a greater RF Joule heating during operation of the RF semiconductor chip (106) than the first group of bonding wires or tapes (132).