A method for processing micro-hole of upper mold used for laminating a thin film sheet using femtosecond pulsed laser

摘要

The present invention relates to a method of processing micro-holes using ultra-short pulse lasers, particularly femtosecond lasers, and improves roundness and cylinderity while improving the surface roughness of the inner surfaces of micro-holes formed in vacuum plates used for separation and lamination of thin film sheets. It relates to a method of improving the quality of micro-holes by securing drawings and maximizing productivity according to the improvement of processing speed. The micro-hole processing method using a femtosecond laser of the present invention is a micro-hole processing method formed in an upper mold for adsorbing, transporting, and laminating a thin-film ceramic sheet, a thin-film metal sheet, a thin-film coating film, etc., n (n is a natural number greater than or equal to 2) fault layers are set in the thickness direction of the upper mold, and the surface of the fault layer is irradiated with a femtosecond laser in a predetermined pattern to 2D process the hole to the thickness up to the next fault layer, and in the Z-axis direction drilling holes by sequentially irradiating the femtosecond laser to the monolayer while lowering the focus of the laser by 1/n; a boring step of adjusting the diameter of the micro-hole to be processed and improving the surface roughness of the inner surface of the hole by irradiating the femtosecond laser along the inner surface of the hole in a 3D shape; chamfering or rounding the periphery of the entrance side of the hole in order to prevent damage to the thin film sheet, such as generation of burrs that may occur during laser processing and the pressing, tearing, and tearing of the thin film sheet; It provides a micro-hole processing method using a femtosecond laser configured including a.