Ag ALLOY CYLINDRICAL SPUTTERING TARGET, SPUTTERING APPARATUS AND METHOD FOR PRODUCING ELECTRONIC DEVICE

摘要

An Ag alloy cylindrical sputtering target containing an Ag alloy, targeting the surface layer portion of the Ag alloy cylindrical sputtering target, and using CuKα rays to conduct X-ray diffraction measurement in the range of 30° to 80° diffraction angle (2θ) In the X-ray diffraction pattern obtained by performing a plurality of peaks derived from the crystal plane of the Ag alloy, the crystal orientation content ratio calculated from the peak intensity of each crystal plane based on the following formula (1) is all less than 0.5. Ag alloy cylindrical sputtering target. A step of preparing an alloy molten metal containing Ag and an alloying element, a step of producing the alloy atomized powder by a gas atomization method, and a step of spraying the atomized powder to a cylindrical backing tube, comprising a step of Method of manufacturing an Ag alloy cylindrical sputtering target, characterized in that. An object of the present invention is to provide an Ag alloy cylindrical sputtering target, a sputtering apparatus, and a method for manufacturing an electronic device capable of uniform film thickness distribution by sputtering film formation.