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Self-alignment features for III-V ridge process and angled facet die
Self-alignment features for III-V ridge process and angled facet die
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机译:III-V脊工艺的自对准特征和成角度小心
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摘要
A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.
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