Method for forming Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Windows for Thermal Transport

摘要

A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.